[
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    "a_ic1_o": "",
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    "a_ic1_ss": 69.016,
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    "a_ic2_ss": "",
    "a_nmt_ms": "",
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    "a_od1_ms": "",
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    "a_od2_ms": "",
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    "accelerator": "-",
    "accelerator_no": 0,
    "benchmark": "mobilenet-v2-1.0-160 (160x160)",
    "code": "https://github.com/mlperf/inference_results_v0.5/tree/master/open/dividiti/code",
    "details": "https://github.com/mlperf/inference_results_v0.5/blob/master/open/dividiti/systems/hikey960-armnn-v19.08-neon.json",
    "ff_d": "",
    "ff_e": "x",
    "ff_m": "x",
    "ff_s": "",
    "id": "Inf-0.5-221",
    "notes": "Mobile chip in embedded form factor (development board).",
    "p_ic1_ms": "",
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    "p_ic1_ss": 128.061,
    "p_ic2_ms": "",
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    "p_nmt_ms": "",
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    "processor": "HiSilicon Kirin960",
    "processor_no": 1,
    "seq_number": 148,
    "software": "ArmNN v19.08 (Neon)",
    "submitter": "dividiti",
    "system": "Linaro HiKey960 (hikey960)"
  }
]