[ { "a_ic1_ms": "", "a_ic1_o": "", "a_ic1_s": "", "a_ic1_ss": 63.716, "a_ic2_ms": "", "a_ic2_o": "", "a_ic2_s": "", "a_ic2_ss": "", "a_nmt_ms": "", "a_nmt_o": "", "a_nmt_s": "", "a_nmt_ss": "", "a_od1_ms": "", "a_od1_o": "", "a_od1_s": "", "a_od1_ss": "", "a_od2_ms": "", "a_od2_o": "", "a_od2_s": "", "a_od2_ss": "", "accelerator": "-", "accelerator_no": 0, "benchmark": "mobilenet-v1-0.75-128 (128x128)", "code": "https://github.com/mlperf/inference_results_v0.5/tree/master/open/dividiti/code", "details": "https://github.com/mlperf/inference_results_v0.5/blob/master/open/dividiti/systems/hikey960-tflite-v1.15.json", "ff_d": "", "ff_e": "x", "ff_m": "x", "ff_s": "", "id": "Inf-0.5-243", "notes": "Mobile chip in embedded form factor (development board).", "p_ic1_ms": "", "p_ic1_o": "", "p_ic1_s": "", "p_ic1_ss": 41.496, "p_ic2_ms": "", "p_ic2_o": "", "p_ic2_s": "", "p_ic2_ss": "", "p_nmt_ms": "", "p_nmt_o": "", "p_nmt_s": "", "p_nmt_ss": "", "p_od1_ms": "", "p_od1_o": "", "p_od1_s": "", "p_od1_ss": "", "p_od2_ms": "", "p_od2_o": "", "p_od2_s": "", "p_od2_ss": "", "processor": "HiSilicon Kirin960", "processor_no": 1, "seq_number": 170, "software": "TFLite v1.15.0-rc2", "submitter": "dividiti", "system": "Linaro HiKey960 (hikey960)" } ]